Fabrication of Through-glass Vias (TGV) based 3D microstructures in glass substrate by a lithography-free process for MEMS applications

Numerical and experimental investigations into microchannel formation in glass substrate using electrochemical discharge machining

(2019) Dileep Kumar Mishra et al.   JOURNAL OF MICROMECHANICS AND MICROENGINEERING

Fabrication of multiple through-holes in non-conductive materials by Electrochemical Discharge Machining for RF MEMS Packaging

(2019) Julfekar Arab et al.   JOURNAL OF MATERIALS PROCESSING TECHNOLOGY

Thin uniform nickel seed layer formation and its impact on Ni-Cu contact adhesion for c-Si solar cell applications

(2017) Vishnu Kant Bajpai et al.   SOLAR ENERGY

Trends in Effective Diffusion Coefficients for Ion-Exchange Strengthening of Soda-Lime-Silicate Glasses

(2017) Stefan Karlsson et al.   Frontiers in Materials

Palladium-free electroless deposition of pure copper film on glass substrate using hydrazine as reducing agent

(2016) N. Nobari et al.   APPLIED SURFACE SCIENCE

Copper Plating on Glass Using a Solution Processed Copper-Titanium Oxide Catalytic Adhesion Layer

(2016) Kyohei Okabe et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Electroless Nickel Plating – A Review

(2016) C. A. Loto   Silicon

Electrochemical Copper Metallization of Glass Substrates Mediated by Solution-Phase Deposition of Adhesion-Promoting Layers

(2015) Alexander Miller et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

30 years of electroless plating for semiconductor and polymer micro-systems

(2015) Y. Shacham-Diamand et al.   MICROELECTRONIC ENGINEERING

Design, Fabrication, and Characterization of Ultrathin 3-D Glass Interposers With Through-Package-Vias at Same Pitch as TSVs in Silicon

(2014) Vijay Sukumaran et al.   IEEE Transactions on Components Packaging and Manufacturing Technology

Electroless nickel, alloy, composite and nano coatings – A critical review

(2013) Jothi Sudagar et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Evolution of microstructure and electrical conductivity of electroless copper deposits on a glass substrate

(2012) Xiaoyun Cui et al.   THIN SOLID FILMS

Electroless plating of copper on surface-modified glass substrate

(2011) Wei Su et al.   APPLIED SURFACE SCIENCE

Study of Ni-catalyst for electroless Ni–P deposition on glass fiber

(2011) Libo Li et al.   MATERIALS CHEMISTRY AND PHYSICS

Deep plasma etching of glass with a silicon shadow mask

(2007) K. Kolari   SENSORS AND ACTUATORS A-PHYSICAL