Electronic cooling using water flow in aluminum metal foam heat sink: Experimental and numerical approach

出版年份 2016 全文链接

标题

作者

关键词

Electronics cooling, Forced convection, Porous media, Heat transfer

出版物

INTERNATIONAL JOURNAL OF THERMAL SCIENCES

Volume 109, Issue -, Pages 182-200

出版商

Elsevier BV

发表日期

2016-06-12

DOI

10.1016/j.ijthermalsci.2016.06.007

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