Identification of kissing defects in adhesive bonds using infrared thermography

标题
Identification of kissing defects in adhesive bonds using infrared thermography
作者
关键词
C. Non-destructive testing, C. Thermal analysis, B. Composites, Kissing defects, Pulse phase thermography
出版物
INTERNATIONAL JOURNAL OF ADHESION AND ADHESIVES
Volume 64, Issue -, Pages 168-178
出版商
Elsevier BV
发表日期
2015-10-31
DOI
10.1016/j.ijadhadh.2015.10.018

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