4.7 Article

Enhanced Hall-Petch strengthening in graphene/Cu nanocomposites

期刊

JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY
卷 87, 期 -, 页码 176-183

出版社

JOURNAL MATER SCI TECHNOL
DOI: 10.1016/j.jmst.2021.02.013

关键词

Hall-Petch relation; Graphene composite; Strengthening; Molecular dynamics simulation; Dislocations

资金

  1. Natural Science Foundation of Shaanxi Province [2019TD-020]
  2. Natural Science Basic Research Plan in Shaanxi Province of China [2020JM-41, 2020JM-33]
  3. National Natural Science Foundation of China [51471131]
  4. Fundamental Research Funds for the Central Universities

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The study demonstrates that embedding graphene into nanocrystalline Cu can enhance the mechanical properties of materials, delay softening, and increase the Hall-Petch slope, which is crucial for overcoming strength limitations.
Grain size dependent strength, known as Hall-Petch relation, has been approved to be valid in crystalline metals and alloys. However, softening would eventually occur as grain size reduced into nanoscale that below a critical value. Hence, it is essential to find a way to break the strength limitation by avoiding the deformation mechanism transition from dislocation-mediated to grain-boundary-mediated processes. By replacing grain boundary (GB) of nanocrystalline Cu with graphene, in the present study, molecular dynamics simulations show that graphene-boundary (GrB) embedded GrB/Cu nanocomposites exhibit enhanced enlarged Hall-Petch slope with decreasing grain size. The absence of inverse-Hall-Petch relation and the extremely high strength derived at the GrB/Cu nanocomposites were interpreted by the high back stress and abundant dislocation activity that attributed from the high-degree of heterogeneous structure of the nanocomposites. (C) 2021 Published by Elsevier Ltd on behalf of The editorial office of Journal of Materials Science & Technology.

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