标题
Come together: On-chip bioelectric wound closure
作者
关键词
-
出版物
BIOSENSORS & BIOELECTRONICS
Volume 192, Issue -, Pages 113479
出版商
Elsevier BV
发表日期
2021-07-08
DOI
10.1016/j.bios.2021.113479
参考文献
相关参考文献
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