A Survey of Emerging Interconnects for On-Chip Efficient Multicast and Broadcast in Many-Cores

出版年份 2016 全文链接

标题

作者

关键词

出版物

Volume 16, Issue 1, Pages 58-72

出版商

Institute of Electrical and Electronics Engineers (IEEE)

发表日期

2016-02-11

DOI

10.1109/mcas.2015.2510199

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