4.7 Article

High-throughput rapid experimental alloy development (HT-READ)

期刊

ACTA MATERIALIA
卷 221, 期 -, 页码 -

出版社

PERGAMON-ELSEVIER SCIENCE LTD
DOI: 10.1016/j.actamat.2021.117352

关键词

High-throughput; Alloy development; Machine learning; Additive manufacturing

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This article presents a high-throughput rapid experimental alloy development method that integrates a closed-loop material screening process and artificial intelligence agent technology. It achieves a unified framework for computational identification, experimental preparation, and high-throughput analysis, preventing institutional knowledge loss and enabling the use of new experimental data in new design objectives.
The current bulk materials discovery cycle has several inefficiencies from initial computational predictions through fabrication and analyses. Materials are generally evaluated in a singular fashion, relying largely on human-driven compositional choices and analysis of the volumes of generated data, thus also slowing validation of computational models. To overcome these limitations, we developed a high-throughput rapid experimental alloy development (HT-READ) methodology that comprises an integrated, closed-loop material screening process inspired by broad chemical assays and modern innovations in automation. Our method is a general framework unifying computational identification of ideal candidate materials, fabrication of sample libraries in a configuration amenable to multiple tests and processing routes, and analysis of the candidate materials in a high-throughput fashion. An artificial intelligence agent is used to find connections between compositions and material properties. New experimental data can be leveraged in subsequent iterations or new design objectives. The sample libraries are assigned unique identifiers and stored to make data and samples persistent, thus preventing institutional knowledge loss. (c) 2021 The Author(s). Published by Elsevier Ltd on behalf of Acta Materialia Inc. This is an open access article under the CC BY-NC-ND license ( http://creativecommons.org/licenses/by-nc-nd/4.0/ )

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