Mechanical, thermal and dielectric properties of graphene oxide/polyimide resin composite

Graphene oxide (GO) sheets have captured the attention of the scientific community because of its excellent performance and applicability. Hence, studying its reinforcing effects on polyimide (PI) resin is an important research topic. In this study, samples of GO-reinforced PI resin were prepared by hot pressing. The effects of GO as nanofiller on the structure and morphology as well as on the mechanical, thermal, and dielectric properties of the GO/PI resin composites were investigated carefully to provide a practical strategy for the use of the polymer-based composites. The GO nanosheets were dispersed uniformly into the PI matrix by ultrasonication, as illustrated by scanning electron microscopic images (SEM). Compared with pure PI, the GO/PI resin composite loaded with 1 wt% GO showed improved tensile strength by 38.9%, flexural strength by 24.8%, and impact strength by 40.7%. Dynamic mechanical analysis test showed that the addition of GO (1 wt%) increased the glass transition temperature by nearly 9.1 degrees C. In addition, the thermal stability and the dielectric constant were also enhanced by adding only a small amount of GO. This approach provides a strategy for developing simple and cost-effective GO-polymer resin composite materials.