Detection of solder paste defects with an optimization‐based deep learning model using image processing techniques

出版年份 2021 全文链接

标题

作者

关键词

出版物

Volume ahead-of-print, Issue ahead-of-print, Pages -

出版商

Emerald

发表日期

2021-08-11

DOI

10.1108/ssmt-04-2021-0013

参考文献

查看 4 条相关文献

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