Post-Fabrication Trimming of Silicon Photonic Ring Resonators at Wafer-Scale

出版年份 2021 全文链接

标题

作者

关键词

出版物

Volume 39, Issue 15, Pages 5083-5088

出版商

Institute of Electrical and Electronics Engineers (IEEE)

发表日期

2021-05-26

DOI

10.1109/jlt.2021.3079801

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