Highly conductive thermal interface materials with vertically aligned graphite-nanoplatelet filler towards: High power density electronic device cooling
出版年份 2021 全文链接
标题
Highly conductive thermal interface materials with vertically aligned graphite-nanoplatelet filler towards: High power density electronic device cooling
作者
关键词
Graphite nanoplatelets, Thermal conductivity, Orientation, Vertically aligned, Hot pressing
出版物
CARBON
Volume 182, Issue -, Pages 445-453
出版商
Elsevier BV
发表日期
2021-06-16
DOI
10.1016/j.carbon.2021.06.048
参考文献
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