Cu to Cu direct bonding at low temperature with high density defect in electrodeposited Cu

Evolution of microstructures and mechanical properties of ultrahigh strength, pure electrodeposited Cu during self-annealing

(2020) Chaerin Lee et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Comparison of oxidation in uni-directionally and randomly oriented Cu films for low temperature Cu-to-Cu direct bonding

(2018) Chih-Han Tseng et al.   Scientific Reports

Effects of Organic Additives on Grain Growth in Electrodeposited Cu Thin Film during Self-Annealing

(2017) Minjae Sung et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Superior texture-controlled ZnO thin film using electrochemical deposition

(2016) Xiaodong Ren et al.   SOLAR ENERGY

In-situ study on the self-annealing behavior of electroplated Cu through the cantilever method, XRD, and EBSD

(2016) Cheng-En Ho et al.   SURFACE & COATINGS TECHNOLOGY

Low-temperature direct copper-to-copper bonding enabled by creep on (111) surfaces of nanotwinned Cu

(2015) Chien-Min Liu et al.   Scientific Reports

Low-temperature direct copper-to-copper bonding enabled by creep on highly (111)-oriented Cu surfaces

(2014) Chien-Min Liu et al.   SCRIPTA MATERIALIA