Capturing cold-spray bonding features of pure Cu from in situ deformation behavior using a high-accuracy material model

标题
Capturing cold-spray bonding features of pure Cu from in situ deformation behavior using a high-accuracy material model
作者
关键词
Cold spray, Modeling, Dynamic deformation, Impact bonding, Process conditions
出版物
SURFACE & COATINGS TECHNOLOGY
Volume 413, Issue -, Pages 127087
出版商
Elsevier BV
发表日期
2021-03-20
DOI
10.1016/j.surfcoat.2021.127087

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