Experimental study on uniformity of copper layer with microstructure arrays by electroforming
出版年份 2021 全文链接
标题
Experimental study on uniformity of copper layer with microstructure arrays by electroforming
作者
关键词
-
出版物
The International Journal of Advanced Manufacturing Technology
Volume 114, Issue 7-8, Pages 2019-2030
出版商
Springer Science and Business Media LLC
发表日期
2021-04-05
DOI
10.1007/s00170-021-06992-w
参考文献
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