Cu-Cu joining using citrate coated ultra-small nano-silver pastes

Wetting and spreading behaviors of Al-Si alloy on surface textured stainless steel by ultrafast laser

(2020) Zhiyang Liu et al.   APPLIED SURFACE SCIENCE

Robust bonding and thermal-stable Ag–Au joint on ENEPIG substrate by micron-scale sinter Ag joining in low temperature pressure-less

(2020) Chuantong Chen et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Effect of substrates on the formation of Kirkendall voids in Sn/Cu joints

(2019) Jieshi Chen et al.   Welding in the World

The Zn accumulation behavior, phase evolution and void formation in Sn-xZn/Cu systems by considering trace Zn: a combined experimental and theoretical study

(2019) Jieshi Chen et al.   Journal of Materials Research and Technology-JMR&T

The mixture of silver nanowires and nanosilver-coated copper micronflakes for electrically conductive adhesives to achieve high electrical conductivity with low percolation threshold

(2019) Qian Wang et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Phase stability, elasticity, hardness and electronic structures for binary MnBm (M = Ni, Cr, Mo, W, n = 23, 5, 3, 1, m = 6, 3, 2, 1) borides: a comprehensive study using first principles

(2019) H. K. Zhang et al.   PHASE TRANSITIONS

An Ultralow Loss Inductorless $dv/dt$ Filter Concept for Medium-Power Voltage Source Motor Drive Converters With SiC Devices

(2018) Erik Velander et al.   IEEE TRANSACTIONS ON POWER ELECTRONICS

Effect of electroplated Au layer on bonding performance of Ag pastes

(2018) Taikun Fan et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Solvent Effects on Molecular Adsorption on Ag Surfaces: Polyvinylpyrrolidone Oligomers

(2018) Tonnam Balankura et al.   Journal of Physical Chemistry C

New Resonant Gate Driver Circuit for High-Frequency Application of Silicon Carbide MOSFETs

(2017) Jaya Venkata Phani Sekhar Chennu et al.   IEEE TRANSACTIONS ON INDUSTRIAL ELECTRONICS

15-kV/40-A FREEDM Supercascode: A Cost-Effective SiC High-Voltage and High-Frequency Power Switch

(2017) Xiaoqing Song et al.   IEEE TRANSACTIONS ON INDUSTRY APPLICATIONS

Investigation of Au/Si Eutectic Wafer Bonding for MEMS Accelerometers

(2017) Dongling Li et al.   Micromachines

Predicting kinetic nanocrystal shapes through multi-scale theory and simulation: Polyvinylpyrrolidone-mediated growth of Ag nanocrystals

(2016) Tonnam Balankura et al.   JOURNAL OF CHEMICAL PHYSICS

Novel interface material used in high power electronic die-attaching on bare Cu substrates

(2016) Su-Yan Zhao et al.   JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS

Ni 3 Sn 4 -composed die bonded interface rapidly formed by ultrasonic-assisted soldering of Sn/Ni solder paste for high-temperature power device packaging

(2016) Hongjun Ji et al.   MATERIALS & DESIGN

Mechanical behavior of ultrafine-grained high-Mn steels containing nanoscale oxides produced by powder technology

(2016) Jonggyu Jeon et al.   MATERIALS & DESIGN

Survey of High-Temperature Reliability of Power Electronics Packaging Components

(2015) R. Khazaka et al.   IEEE TRANSACTIONS ON POWER ELECTRONICS

Effects of Fe2NiO4 nanoparticles addition into lead free Sn–3.0Ag–0.5Cu solder pastes on microstructure and mechanical properties after reflow soldering process

(2015) Srivalli Chellvarajoo et al.   MATERIALS & DESIGN

Al/stainless-invar composites with tailored anisotropy for thermal management in light weight electronic packaging

(2015) Sophie Ryelandt et al.   MATERIALS & DESIGN

Electrical behavior of Au–Ge eutectic solder under aging for solder bump application in high temperature Electronics

(2013) F.L. Lau et al.   MICROELECTRONICS RELIABILITY

A preliminary study on the thermal and mechanical performances of sintered nano-scale silver die-attach technology depending on the substrate metallization

(2012) F. Le Henaff et al.   MICROELECTRONICS RELIABILITY

Investigations on dehydration processes of trisodium citrate hydrates

(2012) Junyan Gao et al.   Frontiers of Chemical Science and Engineering

Review of Packaging of Optoelectronic, Photonic, and MEMS Components

(2011) Tolga Tekin   IEEE JOURNAL OF SELECTED TOPICS IN QUANTUM ELECTRONICS

Reaction dynamics of diffusion soldering with the eutectic Au–Sn alloy on copper and silver substrates

(2011) Harald Etschmaier et al.   INTERMETALLICS

Role of Citric Acid in the Formation of Silver Nanoplates through a Synergistic Reduction Approach

(2009) X. C. Jiang et al.   LANGMUIR

Sensitivity analysis of packaging effect of silicon-based piezoresistive pressure sensor

(2009) Tsung-Lin Chou et al.   SENSORS AND ACTUATORS A-PHYSICAL

Scanning moiré fringe imaging by scanning transmission electron microscopy

(2009) Dong Su et al.   ULTRAMICROSCOPY

Alloy design of Zn–Al–Cu solder for ultra high temperatures

(2007) Namhyun Kang et al.   JOURNAL OF ALLOYS AND COMPOUNDS