Melting of PCMs Embedded in Copper Foams: An Experimental Study

A smart possible way to cool electronics equipment is represented by passive methods, which do not require an additional power input, such as Phase Change Materials (PCMs). PCMs have the benefit of their latent heat being exploited during the phase change from solid to liquid state. This paper experimentally investigates the melting of different PCMs having different melting temperatures (42, 55 and 64 degrees C). Two copper foams, having 10 PPI and relative densities of 6.7% and 9.5%, i.e., porosities of 93.3% and 90.5%, respectively, are used to enhance the thermal conductivity of PCMs. The block composed by the PCM and the copper foam is heated from one side, applying three different heat fluxes (10, 15 and 20 kW m(-2)): the higher the heat flux, the higher the temperature reached by the heated side and the shorter the time for a complete melting of the PCM. The copper foam with a relative density of 9.5% shows slightly better performance, whereas the choice of the melting temperature of the PCM depends on the time during which the passive cooling system must work. The effect of the foam material is also presented: a copper foam presents better thermal performances than an aluminum foam with the same morphological characteristics. Finally, experimental dimensionless results are compared against values predicted by a correlation previously developed.

Automated summary

Passive cooling methods, such as Phase Change Materials (PCMs), are a smart possible way to cool electronics equipment without additional power input. This study experimentally investigates the melting process of different PCMs with various melting temperatures and the use of copper foam to enhance thermal conductivity. Results show that higher heat flux leads to shorter PCM melting time, and copper foam with a relative density of 9.5% performs slightly better in this cooling system.