4.7 Article

Ductile damage of AA2024-T3 under shear loading: Mechanism analysis through in-situ laminography

期刊

ACTA MATERIALIA
卷 205, 期 -, 页码 -

出版社

PERGAMON-ELSEVIER SCIENCE LTD
DOI: 10.1016/j.actamat.2020.116556

关键词

In situ; Synchrotron radiation computed tomography; Aluminum alloy; Ductile fracture; Shear

资金

  1. [Cominside ANR-14-CE07-0034]
  2. [LAMBDA ANR-17-CE08-0051]

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This study investigates the fracture mechanism of aluminum alloy AA2024-T3 under shear loading using X-ray synchrotron laminography, revealing the microscale defects population and their evolution, and proposing a specific fracture mechanism based on these observations.
The mechanisms leading to fracture of aluminum alloy AA2024-T3 under shear loading are investigated via X-ray synchrotron laminography. A 1mm-thick flat double-gage section shear specimen is loaded inside a synchrotron X-ray beamline. The microscale defects population is reconstructed on six loading steps as well as on the broken specimen. The material exhibits an initial void volume fraction of 0.7% as well as a high concentration of large Cu-rich intermetallic particles. Using 2D Digital Image Correlation of projected volume data, based on the void contrast, it is possible to track the evolution of both types of mesoscale defects throughout the loading and to correlate the deformation mechanisms with the local strains. Upon mechanical loading, pre-existing voids rotate and elongate following the deformation of the aluminum matrix. The intermetallic particles fail at early loading stages in a brittle manner, leading to the nucleation of voids normal to the maximum principal stress direction. The newly-created voids continue to grow during the subsequent loading steps impeded by the fragmented particles, eventually forming micro-cracks. A fracture mechanism is proposed based on these observations and assessed with a representative volume element simulation, pointing towards the formation of a shear localization band during the final loading step. (C) 2020 Acta Materialia Inc. Published by Elsevier Ltd. This is an open access article under the CC BY license

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