The effect of silver and copper nanoparticles as resin fillers on less-studied properties of UF-based particleboards

标题
The effect of silver and copper nanoparticles as resin fillers on less-studied properties of UF-based particleboards
作者
关键词
-
出版物
Wood Material Science & Engineering
Volume -, Issue -, Pages 1-11
出版商
Informa UK Limited
发表日期
2020-11-26
DOI
10.1080/17480272.2020.1847186

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