Microstructure and thermal conductivity of Cu-Cu2AlNiZnAg/diamond coatings on pure copper substrate via high-energy mechanical alloying method

标题
Microstructure and thermal conductivity of Cu-Cu2AlNiZnAg/diamond coatings on pure copper substrate via high-energy mechanical alloying method
作者
关键词
High entropy alloys, Mechanical alloying, Coating, Annealing, Microhardness, Thermal conductivity
出版物
Surfaces and Interfaces
Volume 21, Issue -, Pages 100742
出版商
Elsevier BV
发表日期
2020-10-07
DOI
10.1016/j.surfin.2020.100742

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