Self-assembled three-dimensional structure with optimal ratio of GO and SiC particles effectively improving the thermal conductivity and reliability of epoxy composites
出版年份 2020 全文链接
标题
Self-assembled three-dimensional structure with optimal ratio of GO and SiC particles effectively improving the thermal conductivity and reliability of epoxy composites
作者
关键词
GO-SiC structure, Epoxy resin, Thermal conductivity, Reliability
出版物
COMPOSITES COMMUNICATIONS
Volume 22, Issue -, Pages 100448
出版商
Elsevier BV
发表日期
2020-08-25
DOI
10.1016/j.coco.2020.100448
参考文献
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