4.7 Article

A novel method to prevent cracking in directed energy deposition of Inconel 738 by in-situ doping Inconel 718

期刊

MATERIALS & DESIGN
卷 197, 期 -, 页码 -

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ELSEVIER SCI LTD
DOI: 10.1016/j.matdes.2020.109214

关键词

Directed energy deposition; Additive manufacturing; Inconel 738; Inconel 718; Cracking

资金

  1. National Key Research and Development Program of China [2018YFC0310400]

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In the DED process of Inconel 738, in-situ doping a small amount of Inconel 718 between deposited layers can effectively prevent cracking, improve strength and plasticity, and enhance the printability of unweldable superalloys in additive manufacturing.
Directed energy deposition (DED) of Ni-based superalloys has wide applications in the fields of aviation, energy and power. However, for the non-weldable superalloys like Inconel 738, cracking frequently occurs during DED and cannot be thoroughly controlled up to now. We propose a novel method to prevent the cracking during Inconel 738 DED, in which a small amount of Inconel 718 is in-situ doped between the deposited layers of Inconel 738. The obtained layered-gradient-material is found to be free of both macroand micro-cracks. The microstructure shows that doping Inconel 718 cannot interrupt the epitaxial growth of grains, but can modify the precipitation of gamma. In Inconel 718 layers, nano gamma' particles are intensively precipitated only in the inter-dendrites, while in Inconel 738 layers, they are precipitated in both the interand inner-dendrites. This modification on gamma ' precipitation can effectively decrease the inner stress and alleviate the stress concentration at the grain boundaries, thus the cracking is prevented. The tensile tests, which were conducted at room temperature, 600 degrees C and 800 degrees C respectively, demonstrate that the composite deposited workpieces possess promising strength and plasticity. The proposed method has great potential to improve the printability of un-weldable superalloys in additive manufacturing. (C) 2020 The Author(s). Published by Elsevier Ltd.

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