Resistance to Growth of Molds for Wood Modified with Hydrophobic Hybrid Silica Gel Containing Copper Amine Complexes

标题
Resistance to Growth of Molds for Wood Modified with Hydrophobic Hybrid Silica Gel Containing Copper Amine Complexes
作者
关键词
-
出版物
Materials
Volume 14, Issue 3, Pages 577
出版商
MDPI AG
发表日期
2021-01-27
DOI
10.3390/ma14030577

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