Improved electrochemical reversibility of Zn plating/stripping: a promising approach to suppress water-induced issues through the formation of H-bonding

标题
Improved electrochemical reversibility of Zn plating/stripping: a promising approach to suppress water-induced issues through the formation of H-bonding
作者
关键词
Zn anode, Hydrogen evolution reaction, Corrosion, H-bonding, Additive
出版物
Materials Today Energy
Volume -, Issue -, Pages 100563
出版商
Elsevier BV
发表日期
2020-10-15
DOI
10.1016/j.mtener.2020.100563

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