4.7 Article

Microstructural equivalence between bending and uniaxial creep

期刊

SCRIPTA MATERIALIA
卷 186, 期 -, 页码 99-103

出版社

PERGAMON-ELSEVIER SCIENCE LTD
DOI: 10.1016/j.scriptamat.2020.04.033

关键词

Bending creep; Creep substructure; High throughput characterization; Steady-state creep microstructure

资金

  1. Aeronautical Research and Development Board, India [ARDB 0242]
  2. Ministry of Human Resource Development and Ministry of Power, Government of India [IMPRINT 0009]

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Recently, bending creep has been shown to facilitate the evaluation of creep properties of materials in high throughput fashion. Here, electron back-scattered diffraction analysis was used to observe steady-state substructures formed under bending and uniaxial creep tests. At a given combination of stress and temperature, the sizes of the steady-state sub-grains formed in both the cantilever and the uniaxial test samples were identical. By establishing the microstructural equivalence between bending and uniaxial creep, this study unequivocally validates bending tests for studying the creep response of materials. (C) 2020 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.

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