4.6 Article

Prospects for Wide Bandgap and Ultrawide Bandgap CMOS Devices

期刊

IEEE TRANSACTIONS ON ELECTRON DEVICES
卷 67, 期 10, 页码 4010-4020

出版社

IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/TED.2020.3010471

关键词

Silicon carbide; Photonic band gap; Silicon; MOS devices; Gallium nitride; Logic gates; Diamond; AlN; complementary metal-oxide-semiconductor-based design (CMOS); diamond; GaN; SiC; wide bandgap

资金

  1. Intel Corporation
  2. Air Force Office of Scientific Research [FA9550-17-1-0048]
  3. Semiconductor Research Corporation (SRC)
  4. DARPA under the JUMP ComSenter program
  5. NSF [NNCI-1542081, 1710298, 1534303]

向作者/读者索取更多资源

Power and RF electronics applications have spurred massive investment into a range of wide and ultrawide bandgap semiconductor devices which can switch large currents and voltages rapidly with low losses. However, the end systems using these devices are often limited by the parasitics of integrating and driving these chips from the silicon complementary metal-oxide-semiconductor-based design (CMOS) circuitry necessary for complex control logic. For that reason, implementation of CMOS logic directly in the wide bandgap platform has become a way for each maturing material to compete. This review examines potential CMOS monolithic and hybrid approaches in a variety of wide bandgap materials.

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