Thermoelectric Property Requirements for On-Chip Cooling of Device Transients

出版年份 2020 全文链接

标题

作者

关键词

出版物

Volume 67, Issue 9, Pages 3716-3721

出版商

Institute of Electrical and Electronics Engineers (IEEE)

发表日期

2020-07-31

DOI

10.1109/ted.2020.3009085

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