Highly thermally conductive polybenzoxazine composites based on boron nitride flakes deposited with copper particles

出版年份 2020 全文链接

标题

作者

关键词

Hybrid filler, Thermal conductivity, Contact resistance, Boron nitride, Polybenzoxazine

出版物

Volume 191, Issue -, Pages 108698

出版商

Elsevier BV

发表日期

2020-03-27

DOI

10.1016/j.matdes.2020.108698

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