4.7 Article

Thermal conductivity of alignedCNT-polyethylene nanocomposites and correlation with the interfacial thermal resistance

期刊

POLYMER COMPOSITES
卷 41, 期 9, 页码 3787-3797

出版社

WILEY
DOI: 10.1002/pc.25676

关键词

CNT-polyethylene (PE) nanocomposite; interfacial defects; interfacial thermal resistance; mechanical deformation; molecular dynamics modeling; the CNT volume fraction; thermal conductivity

资金

  1. National Natural Science Foundation of China [11672100]
  2. Fundamental Research Fund for the Central Universities [2018B48714]

向作者/读者索取更多资源

Carbon nanotube (CNT) reinforced polymer composites have higher thermal conductivity than polymers themselves, so they have wide application prospects in many thermodynamic applications. It is of great significance to deeply understand the thermal conductivity of polymer nanocomposites and its creations, especially with the CNT-polymer interface. In this article, for CNT-polyethylene (PE) nanocomposites, the temperature distribution and thermal conductivity, and its correlation with the CNT volume fraction, the interfacial thermal resistance caused by interfacial defects in the CNT-PE interface region, and mechanical strain were comprehensively studied through molecular dynamics simulation. The results show that the CNT volume fraction and mechanical stretches have remarkable effects on the thermal conductivity of the nanocomposite, and comparatively the influence of the interfacial defects is weak just in the range of the CNT volume fraction <0.3. The thermal conductivity rapidly increases when the volume fraction of CNTs changes from 0 to 0.20. Under tensile strain, the thermal conductivities kappa(parallel to)and kappa(perpendicular to)(being parallel to and perpendicular to the stretching direction, also the direction of nanotubes) display quite different rules. The kappa(parallel to)increases linearly with the tensile strain, while the kappa(perpendicular to)decreases linearly. After the CNT-PE interfacial defect degreef(d)of assessing the defect extent was introduced, its dependence on the interfacial thermal resistanceR(i)was analytically given, and further the influence of thef(d)on the thermal conductivity was obtained through comparative studies of with/without interfacial defects. We found that the thermal conductivity has a sharply deduce when thef(d)is in the range of 30% to 60%.

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