Surface and subsurface damage of reaction-bonded silicon carbide induced by electrical discharge diamond grinding

出版年份 2020 全文链接

标题

作者

关键词

Subsurface damage, Electrical discharge diamond grinding, Reaction-bonded silicon carbide, Phase transformation, Material migration

出版物

Volume 154, Issue -, Pages 103564

出版商

Elsevier BV

发表日期

2020-04-21

DOI

10.1016/j.ijmachtools.2020.103564

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