A 3D inlet distributor employing copper foam for liquid replenishment and heat transfer enhancement in microchannel heat sinks

标题
A 3D inlet distributor employing copper foam for liquid replenishment and heat transfer enhancement in microchannel heat sinks
作者
关键词
Heat transfer enhancement, Liquid replenishment, Copper foam, Microchannel heat sink, Flow boiling
出版物
INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER
Volume 157, Issue -, Pages 119934
出版商
Elsevier BV
发表日期
2020-06-19
DOI
10.1016/j.ijheatmasstransfer.2020.119934

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