期刊
COMPUTERS & STRUCTURES
卷 235, 期 -, 页码 -出版社
PERGAMON-ELSEVIER SCIENCE LTD
DOI: 10.1016/j.compstruc.2020.106265
关键词
Battery packs; Multiphysics level set method; Thermo-elastic topology optimization; Stress constraints; Temperature constraints
资金
- DARPA [HR0011 -16-2-0032]
- NASA's Transformation Tools and Technologies Project [80NSSC18M0153]
- EPSRC [EP/M002322/1, EP/M002322/2, EP/J014389/1] Funding Source: UKRI
In this paper, we introduce a level set topology optimization formulation considering coupled mechanical and thermal loads. Examples considering stress and compliance minimization under temperature and volume constraints, and mass minimization under stress and temperature constraints, are presented. The p-norm of the stress field and temperature field is used to approximate the maximum stress and temperature, respectively. We show that the minimal compliant topologies under temperature constraints do not necessarily have low stress values, and the stress and temperature requirements can be conflicting. The results also show that designs obtained by ignoring the thermal or structural constraints can result in high values of temperature or stress, respectively, thus demonstrating the importance of using a coupled multi-physics model in the optimization. (C) 2020 Elsevier Ltd. All rights reserved.
作者
我是这篇论文的作者
点击您的名字以认领此论文并将其添加到您的个人资料中。
推荐
暂无数据