Thermally activated diffusion and lattice relaxation in (Si)GeSn materials

Germanium-tin (GeSn) alloys have emerged as a promising material for future optoelectronics, energy harvesting, and nanoelectronics owing to their direct band gap and compatibility with existing Si-based electronics. Yet, their metastability poses significant challenges calling for in-depth investigations of their thermal behavior. With this perspective, this work addresses the interdiffusion processes throughout thermal annealing of pseudomorphic GeSn binary and SiGeSn ternary alloys. In both systems, the initially pseudomorphic layers are relaxed upon annealing exclusively via thermally induced diffusional mass transfer of Sn. Systematic postgrowth annealing experiments reveal enhanced Sn and Si diffusion regimes that manifest at temperatures below 650 degrees C. The amplified low-temperature diffusion and the observation of only subtle differences between binary and ternary hint at the unique metastability of the Si-Ge-Sn material system as the most important driving force for phase separation.