Effects of cutting parameters on the subsurface damage of single crystal copper during nanocutting process

标题
Effects of cutting parameters on the subsurface damage of single crystal copper during nanocutting process
作者
关键词
Molecular dynamics simulation, Nanocutting, Cutting parameters, Dislocation form, Crystal structure
出版物
VACUUM
Volume -, Issue -, Pages 109420
出版商
Elsevier BV
发表日期
2020-04-24
DOI
10.1016/j.vacuum.2020.109420

向作者/读者发起求助以获取更多资源

Reprint

联系作者

Become a Peeref-certified reviewer

The Peeref Institute provides free reviewer training that teaches the core competencies of the academic peer review process.

Get Started

Ask a Question. Answer a Question.

Quickly pose questions to the entire community. Debate answers and get clarity on the most important issues facing researchers.

Get Started