Active metal brazing of silicon nitride ceramics using a Cu-based alloy and refractory metal interlayers

Silicon nitride/silicon nitride joints with refractory metal (W and Mo) interlayers were vacuum brazed using an active braze, Cu-ABA (Cu-3Si-2Al-2.25Ti, wt%), and two interlayer arrangements in a double-lap offset configuration: Si3N4/Cu-ABA/W/Cu-ABA/Mo/Cu-ABA/Si3N4 and Si3N4/Cu-ABA /Si3N4. Titanium segregated at the Si3N4/Cu-ABA and Mo/Cu-ABA interfaces, but not at the W/Cu-ABA interface. The room-temperature compression-shear strength values of Si3N4/Cu-ABA/Si3N4 and Si3N4/Cu-ABA/W/Cu-ABA/Mo/Cu-ABA/Si3N4 joints were 118 +/- 24 MPa and 22 +/- 5 MPa, respectively. Elevated-temperature compression tests showed that Si3N4/Cu-ABA/Si3N4 joints had strength of 31 +/- 6 MPa at 1023 K and 17 +/- 3 MPa at 1073 K. Likewise, Si3N4/Cu-ABA/W/Cu-ABA/Mo/Cu-ABA/Si3N4 joints had strength of 19 +/- 4 MPa at 1023 K and 13 +/- 3 MPa at 1073 K. Knoop microhardness profiles revealed hardness gradients across the joints. The effect of joint microstructure and test configuration on the mechanical behavior is discussed. (C) 2015 Elsevier Ltd and Techna Group S.r.l. All rights reserved.