Kinetic analysis of Cu and Zn dissolution from printed circuit board physical processing dust under oxidative ammonia leaching

出版年份 2020 全文链接

标题

作者

关键词

PCB dust, Ammonia leaching, Ammine complex, Reaction kinetics

出版物

Volume 193, Issue -, Pages 105320

出版商

Elsevier BV

发表日期

2020-03-24

DOI

10.1016/j.hydromet.2020.105320

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