Study of using enhanced heat-transfer flexible phase change material film in thermal management of compact electronic device

出版年份 2020 全文链接

标题

作者

关键词

出版物

Volume 210, Issue -, Pages 112680

出版商

Elsevier BV

发表日期

2020-03-11

DOI

10.1016/j.enconman.2020.112680

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