Development of a New Modeling Technique to Simulate 3-dimensional Electroplating System Considering the Effects of Fluid Flow

Non-Traditional Cell Geometry for Improved Copper Plating Uniformity

(2016) Holly Garich et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Finite element modeling of silver electrodeposition for evaluation of thickness distribution on complex geometries

(2016) Ilja Belov et al.   MATERIALS & DESIGN

Multiphysics coupling simulation of RDE for PCB manufacturing

(2015) Linxian Ji et al.   CIRCUIT WORLD

Simulation study of tertiary current distributions on rotating electrodes

(2012) L Z Tong   TRANSACTIONS OF THE INSTITUTE OF METAL FINISHING

Effect of Convection-Dependent Adsorption of Additives on Microvia Filling in an Acidic Copper Plating Solution

(2011) Su-Mei Huang et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Experimental and modeling analysis of the formation of cuprous intermediate species formed during the copper deposition on a rotating disk electrode

(2010) Jorge Vazquez-Arenas   ELECTROCHIMICA ACTA

Simulation and Modelling in Metal Finishing. Electrochemistry and Electrochemical Reactors for Microfabrication

(2009) S. Roy   TRANSACTIONS OF THE INSTITUTE OF METAL FINISHING

Advanced CAD integrated approach for 3D electrochemical machining simulations

(2007) Marius Purcar et al.   JOURNAL OF MATERIALS PROCESSING TECHNOLOGY