4.5 Article

Negative thermal expansion property of β-Cu2V2O7

期刊

SOLID STATE IONICS
卷 343, 期 -, 页码 -

出版社

ELSEVIER
DOI: 10.1016/j.ssi.2019.115086

关键词

Negative thermal expansion; beta-Cu2V2O7; Coefficient of thermal expansion; Microstructure; Thermal shrink mechanism

资金

  1. National Natural Science Foundation of China [11574276]
  2. Key Natural Science Project of Henan Province [142102210073]

向作者/读者索取更多资源

beta-Cu2V2O7 is prepared by using the solid-state method. We discuss that beta-Cu2V2O7 exhibits large negative thermal expansion property over a wide temperature range and no phase change occurs. The coefficient of thermal expansion is -20.2 x 10(-6) K-1 in temperature range of RT-673 K. The change of cell parameters is obtained from High-temperature XRD. Its phase, microstructure, thermal expansion property, and Raman spectra are analyzed in detail. The underlying mechanism of the negative thermal expansion of beta-Cu2V2O7 involves the coupling effect of the tetrahedron caused by the lateral vibration of the bridge oxygen atom and tensile effect of the tetrahedron. The partial collapse caused by the loss of oxygen atoms is also crucial in this mechanism.

作者

我是这篇论文的作者
点击您的名字以认领此论文并将其添加到您的个人资料中。

评论

主要评分

4.5
评分不足

次要评分

新颖性
-
重要性
-
科学严谨性
-
评价这篇论文

推荐

暂无数据
暂无数据