Laser beam induced thermal-crack propagation for asymmetric linear cutting of silicon wafer

标题
Laser beam induced thermal-crack propagation for asymmetric linear cutting of silicon wafer
作者
关键词
-
出版物
OPTICS AND LASER TECHNOLOGY
Volume 120, Issue -, Pages 105765
出版商
Elsevier BV
发表日期
2019-08-10
DOI
10.1016/j.optlastec.2019.105765

向作者/读者发起求助以获取更多资源

Find Funding. Review Successful Grants.

Explore over 25,000 new funding opportunities and over 6,000,000 successful grants.

Explore

Ask a Question. Answer a Question.

Quickly pose questions to the entire community. Debate answers and get clarity on the most important issues facing researchers.

Get Started