Pattern dependent profile distortion during plasma etching of high aspect ratio features in SiO2

标题
Pattern dependent profile distortion during plasma etching of high aspect ratio features in SiO2
作者
关键词
-
出版物
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A
Volume 38, Issue 2, Pages 023001
出版商
American Vacuum Society
发表日期
2020-01-08
DOI
10.1116/1.5132800

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