Utilizing copper oxide nanoparticles for expedition of solidification within a storage system

In current simulation, influence of using corrugated walls in solidification of paraffin was addressed and to improve the conduction mode, CuO nanoparticles were added to paraffin. Good accommodation was found with empirical data which ensure the accuracy of utilized model. With use of corrugated duct, the solidification rate enhances and time of discharging reduces about 25.7% and more heat released to air layers. Changing the geometry affect the discharging process especially after 140 min and wavy duct has lower temperature than flat duct at the end of solidification. (C) 2019 Elsevier B.V. All rights reserved.