Effect of temperature and substrate surface roughness on wetting behavior and interfacial structure between Sn–35Bi–1Ag solder and Cu substrate

Wetting kinetics and spreading phenomena of Sn-35Bi-1Ag solder on different substrates

(2018) Yulong Li et al.   JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS

Growth behavior of IMCs layer of the Sn–35Bi–1Ag on Cu, Ni–P/Cu and Ni–Co–P/Cu substrates during aging

(2018) Yulong Li et al.   JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS

Reactive wetting of tin/steel and tin/aluminum at 350–450 °C

(2017) Qiaoli Lin et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Microstructure, wetting characteristics and hardness of tin-bismuth-silver (Sn–Bi–Ag) solders on silver (Ag)-surface finished copper (Cu) substrates

(2017) Tama Fouzder et al.   JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS

Effects of surface diffusion and reaction-induced volume shrinkage on morphological evolutions of micro joints

(2017) H.W. Yang et al.   MATERIALS CHEMISTRY AND PHYSICS

Kinetics of wetting and spreading of AgCu filler metal over Ti–6Al–4V substrates

(2016) Xiao Yu et al.   JOURNAL OF MATERIALS SCIENCE

Thermal aging effects on microstructures and mechanical properties of an environmentally friendly eutectic tin-copper solder alloy

(2016) Asit Kumar Gain et al.   MATERIALS & DESIGN

Low temperature bonding for high temperature applications by using SnBi solders

(2015) T.L. Yang et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Ti addition to enhance corrosion resistance of Sn–Zn solder alloy by tailoring microstructure

(2015) Jian-Chun Liu et al.   JOURNAL OF ALLOYS AND COMPOUNDS

A review: On the development of low melting temperature Pb-free solders

(2014) Hiren R. Kotadia et al.   MICROELECTRONICS RELIABILITY

Interfacial reaction and IMC growth between Bi-containing Sn0.7Cu solders and Cu substrate during soldering and aging

(2013) Xiaowu Hu et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Effect of reflow temperature and substrate roughness on wettability, IMC growth and shear strength of SAC387/Cu bonds

(2013) Kiran N. Bhat et al.   JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS

Effects of Ni-coated carbon nanotubes addition on the microstructure and mechanical properties of Sn–Ag–Cu solder alloys

(2013) Zhongbao Yang et al.   MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING

Reactive wetting of AgCuTi filler metal on the TiAl-based alloy substrate

(2012) Yulong Li et al.   APPLIED SURFACE SCIENCE

Effects of the melt state on the microstructure of a Sn–3.5%Ag solder at different cooling rates

(2012) Xiaoyun Li et al.   APPLIED SURFACE SCIENCE

Preferential spreading of molten metal over an anisotropically microstructured surface

(2012) Wen Liu et al.   EPL

Effect of temperature and substrate surface texture on wettability and morphology of IMCs between Sn–0.7Cu solder alloy and copper substrate

(2012) Satyanarayan et al.   JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS

Topographical Anisotropy and Wetting of Ground Stainless Steel Surfaces

(2012) Alfredo Calvimontes et al.   Materials

Dynamics of contact line motion during the wetting of rough surfaces and correlation with topographical surface parameters

(2011) K. J. Kubiak et al.   SCANNING

Grain growth sequence of Cu3Sn in the Cu/Sn and Cu/Sn–Zn systems

(2010) M.Y. Tsai et al.   JOURNAL OF ALLOYS AND COMPOUNDS

AFM analysis of bleaching effects on dental enamel microtopography

(2009) Ana Carolina Pedreira de Freitas et al.   APPLIED SURFACE SCIENCE

Temperature Effect on Intermetallic Compound Growth Kinetics of Cu Pillar/Sn Bumps

(2009) Gi-Tae Lim et al.   JOURNAL OF ELECTRONIC MATERIALS

Wetting behaviour of lead-free Sn-based alloys on Cu and Ni substrates

(2008) S. Amore et al.   MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING