Ultrasonic encapsulation of cinnamon flavor to impart heat stability for baking applications

标题
Ultrasonic encapsulation of cinnamon flavor to impart heat stability for baking applications
作者
关键词
-
出版物
FOOD HYDROCOLLOIDS
Volume 99, Issue -, Pages 105316
出版商
Elsevier BV
发表日期
2019-08-20
DOI
10.1016/j.foodhyd.2019.105316

向作者/读者发起求助以获取更多资源

Publish scientific posters with Peeref

Peeref publishes scientific posters from all research disciplines. Our Diamond Open Access policy means free access to content and no publication fees for authors.

Learn More

Ask a Question. Answer a Question.

Quickly pose questions to the entire community. Debate answers and get clarity on the most important issues facing researchers.

Get Started