A molecular dynamics study on heat conduction of crosslinked epoxy resin based thermal interface materials for thermal management

标题
A molecular dynamics study on heat conduction of crosslinked epoxy resin based thermal interface materials for thermal management
作者
关键词
-
出版物
COMPUTATIONAL MATERIALS SCIENCE
Volume 172, Issue -, Pages 109298
出版商
Elsevier BV
发表日期
2019-09-27
DOI
10.1016/j.commatsci.2019.109298

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