Mechanical, electrical, and thermal reliability of Sn-58wt.%Bi solder joints with Ag-decorated MWCNT for LED package component during aging treatment

标题
Mechanical, electrical, and thermal reliability of Sn-58wt.%Bi solder joints with Ag-decorated MWCNT for LED package component during aging treatment
作者
关键词
-
出版物
COMPOSITES PART B-ENGINEERING
Volume 182, Issue -, Pages 107617
出版商
Elsevier BV
发表日期
2019-11-21
DOI
10.1016/j.compositesb.2019.107617

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