Thermal, Electrical and Mechanical Properties of Expanded Graphite and Micro-SiC Filled Hybrid Epoxy Composite for Electronic Packaging Applications

标题
Thermal, Electrical and Mechanical Properties of Expanded Graphite and Micro-SiC Filled Hybrid Epoxy Composite for Electronic Packaging Applications
作者
关键词
-
出版物
JOURNAL OF ELECTRONIC MATERIALS
Volume 49, Issue 1, Pages 212-225
出版商
Springer Science and Business Media LLC
发表日期
2019-10-25
DOI
10.1007/s11664-019-07681-x

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