Thermal Impact of LED Chips on Quantum Dots in Remote-Chip and On-Chip Packaging Structures

出版年份 2019 全文链接

标题

作者

关键词

出版物

Volume 66, Issue 11, Pages 4817-4822

出版商

Institute of Electrical and Electronics Engineers (IEEE)

发表日期

2019-10-01

DOI

10.1109/ted.2019.2941911

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