期刊
APPLIED THERMAL ENGINEERING
卷 168, 期 -, 页码 -出版社
PERGAMON-ELSEVIER SCIENCE LTD
DOI: 10.1016/j.applthermaleng.2019.114640
关键词
Air cooling; Novel heat sink; Micro heat pipe array; Pin fin; Heat transfer characteristic
资金
- National Key R&D Program of China [2016YFB0601600]
- National Natural Science Foundation of China [51478008]
A novel air-cooled CPU heat sink integrated U-shape micro heat pipe array with rectangular pin fins (U-MHPA-RPF) is proposed. The heat transfer and friction characteristics of U-MHPA-RPF were investigated by the wind tunnel experimental set up systematically. The results show that the operating temperature can be reduced easily below 75 degrees C when the input power reached 130 W. The simplified three-dimensional model was established in ANSYS ICEM, the conjugate heat transfer from the CPU to the air were computed numerically in ANSYS Fluent for a range of air flow at different heating powers. Verified by the experimental results, the thermal resistance of each part of the heat sink is discussed. The contact thermal resistance is the major component, the advantage of the U-MHPA-RPF heat sink is proved by the lower values of the thermal resistance of the heat sink. By changing the Reynolds number, it is found that the cooling device could be operated at small air flow rates to reduce fan power consumption and noise.
作者
我是这篇论文的作者
点击您的名字以认领此论文并将其添加到您的个人资料中。
推荐
暂无数据