期刊
SCIENCE AND TECHNOLOGY OF ADVANCED MATERIALS
卷 20, 期 1, 页码 876-901出版社
TAYLOR & FRANCIS LTD
DOI: 10.1080/14686996.2019.1640072
关键词
Lead-free solder; reliability; IMC; crack; failure
资金
- National Key R&D Program of China [2017YFB0305700]
- Key project of State Key Laboratory of Advanced Welding and Joining [AWJ-19Z04]
- Qing Lan Project
- Six talent peaks project in Jiangsu Province [XCL-022]
- Natural Science Foundation of China [51475220]
- [2015DFA50470]
Electronic products are evolving towards miniaturization, high integration, and multi-function, which undoubtedly puts forward higher requirements for the reliability of solder joints in electronic packaging. Approximately 70% of failure in electronic devices originates during the packaging process, mostly due to the failure of solder joints. With the improvement of environmental protection awareness, lead-free solder joints have become a hot issue in recent years. This paper reviews the research progress on the reliability of lead-free solder joints and discusses the influence of temperature, vibration, tin whisker and electromigration on the reliability of solder joints. In addition, the measures to improve the reliability of solder joints are analyzed according to the problems of solder joints themselves, which provides a further theoretical basis for the study of the reliability of solder joints of electronic products in service.
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