Article
Engineering, Mechanical
Zaiwei Liu, Bin Lin, Xiaohu Liang, Anyao Du
Summary: In this paper, a technology for estimating the mechanical properties and residual stress of machined surfaces, especially for ground silicon wafer, based on laser-excited surface acoustic waves (LSAWs) is developed. Bayesian inversion and Markov chain Monte Carlo (MCMC) method are used to estimate the elastic constants and residual stress of the subsurface damage (SSD) layer, and corresponding uncertainties are provided. Experimental results demonstrate that this technology can accurately characterize SSD and residual stress.
MECHANICAL SYSTEMS AND SIGNAL PROCESSING
(2022)
Article
Engineering, Electrical & Electronic
Jingfei Yin, Qian Bai, Bi Zhang
Summary: This study presents a novel polarized laser scattering (PLS) method for detecting subsurface damage (SSD) in silicon wafers. The PLS signal is sensitive to the depth of SSD, and a relationship between the PLS signal and SSD depth is established for practical applications of the PLS method.
MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING
(2022)
Article
Engineering, Multidisciplinary
Jingfei Yin, Qian Bai, Han Haitjema, Bi Zhang
Summary: This study resolves surface scattering based on the electromagnetic scattering theory, finding that the depolarization caused by surface scattering increases with the surface roughness and the incident angle. Considering the subsurface scattering characteristics and the distribution of the SSD, a solution for the PLS detection is provided, involving the use of a horizontally polarized laser with vertical incidence to minimize the influence of surface scattering and optimize the PLS detection process.
PRECISION ENGINEERING-JOURNAL OF THE INTERNATIONAL SOCIETIES FOR PRECISION ENGINEERING AND NANOTECHNOLOGY
(2022)
Article
Chemistry, Physical
Penghui Li, Xiaoguang Guo, Song Yuan, Ming Li, Renke Kang, Dongming Guo
Summary: This study investigated the nano-grinding process of single crystal silicon through molecular dynamics simulations, revealing that the maximum height of the grinding chip does not always increase with the grinding speed. The research also explored the structural changes and distribution of residual stresses in silicon during the grinding process.
APPLIED SURFACE SCIENCE
(2021)
Article
Engineering, Industrial
Zhaojie Chen, Jin Xie, Junhan Liu, Xiansong He, Cong Zhou
Summary: In the abrasive machining of monocrystalline silicon, the surface and subsurface behavior can be changed by utilizing the impulse discharge between the wheel metal and semiconductor silicon. This method drives a loose-abrasive flow, which results in nano-scale surface removal and thermal modification. The research focuses on the formation behavior of the abrasive-Si interface to improve the surface and subsurface integrity. The results show that the hybrid machining approach with mechanical cut-copying and impulse-discharge thermal modifying action can greatly enhance the surface integrity and form accuracy.
JOURNAL OF MATERIALS PROCESSING TECHNOLOGY
(2023)
Article
Engineering, Mechanical
Hongfei Tao, Yuanhang Liu, Dewen Zhao, Xinchun Lu
Summary: This work explores the mechanism of ductile deformation and subsurface damage evolution of silicon wafers during the ultra-precision grinding process. It provides insights into the phase transition properties and atomic-scale subsurface defects of ground silicon wafers. The influence of abrasive interactions on subsurface deformation is investigated using nanoscratch tests.
TRIBOLOGY INTERNATIONAL
(2023)
Article
Mechanics
Xinying Li, Yufei Gao, Runtao Liu, Wei Zhou
Summary: This paper investigates the subsurface damage depth in diamond wire sawing of multi-crystalline silicon solar cell substrates and establishes a mathematical model. The accuracy of the model is verified through experiments, and the impact of different parameters on subsurface damage depth and microcrack number is predicted.
ENGINEERING FRACTURE MECHANICS
(2022)
Article
Optics
Zhichao Jia, Wei Wang, Xinhua Li, Lingyun Hao
Summary: The damage process of (001) silicon wafer under millisecond Gaussian laser irradiation was investigated, revealing that dislocation multiplication is the main damage mechanism, with melting starting at slip lines. Fracture can also occur outside the spot center. The complexity of the thermal conductivity dependence on dislocation presents challenges in obtaining precise temperature during the cooling period, which requires further research.
OPTICAL ENGINEERING
(2021)
Article
Optics
Jiao Geng, Wei Yan, Liping Shi, Min Qiu
Summary: This study demonstrates an efficient femtosecond laser scanning technique for manufacturing highly regular nanogratings on semiconductor-on-metal thin films. The technique enables high-speed manufacturing with tunable periodicity. The interference effects of the semiconductor-on-metal film also contribute to high energy efficiency during laser nano-processing. The fabricated nanogratings have various applications in refractive index sensing, structural colors, and superhydrophilicity.
LIGHT-SCIENCE & APPLICATIONS
(2022)
Article
Materials Science, Multidisciplinary
Itziar Serrano-Munoz, Alexander Evans, Tatiana Mishurova, Maximilian Sprengel, Thilo Pirling, Arne Kromm, Giovanni Bruno
Summary: The residual stress in laser powder bed fusion (LPBF) IN718 alloy samples produced using a 67 degrees-rotation scan strategy was investigated via laboratory X-ray diffraction (XRD) and neutron diffraction (ND), showing significant non-uniformity and difficulty in accurate determination through the stress balance method.
ADVANCED ENGINEERING MATERIALS
(2022)
Article
Mechanics
Jingfei Yin, Jiuhua Xu, Wenfeng Ding, Honghua Su
Summary: This study proposes the polarized laser scattering (PLS) method to detect the grinding-induced damage of silicon carbide fiber reinforced silicon carbide (SiCf/SiC). It is found that the sensitivity of PLS detection depends on the radiation spot size of the laser beam, with a smaller spot size increasing the sensitivity to MID but also increasing the sensitivity to pre-existing defects. Conversely, a larger spot size decreases the sensitivity. This study is important for expanding the detection of MID of CMC.
COMPOSITE STRUCTURES
(2022)
Article
Physics, Applied
Andreas Doerfler, Afsaneh Asgariyan Tabrizi, Timo Stubler, Andreas Ruediger
Summary: The article discusses the relationship between laser and material parameters and the rate and precision of Raman spectroscopy scanning. It also examines the effects of thermally induced shift and asymmetric broadening on the line profile. An analytical approximation is presented to describe this phenomenon and correct for its impact on the signal. The study provides a quantitative analysis of line asymmetry and allows for optimal determination of Raman signal parameters.
APPLIED PHYSICS LETTERS
(2022)
Article
Optics
Yuri Obata, Koichi Sekino, Kyohei Takeo, Satoru Yoneyama
Summary: This paper proposes an experimental-numerical hybrid method for estimating residual stresses in silicon wafers, which is validated through experiments and compared with traditional X-ray diffraction method. The results demonstrate the successful application of this method in estimating residual stresses in silicon wafers.
OPTICS AND LASERS IN ENGINEERING
(2022)
Article
Engineering, Multidisciplinary
Shenxin Yin, Huapan Xiao, Heng Wu, Chunjin Wang, Chi Fai Cheung
Summary: A theoretical model is developed to accurately and quickly determine the surface roughness and subsurface damage depth of silicon wafers by considering fracture width. The model integrates digital image processing to extract fracture parameters and shows good agreement with experimental results. This image processing-based model provides a reasonable approach for estimating damages in silicon wafers during wire sawing.
PRECISION ENGINEERING-JOURNAL OF THE INTERNATIONAL SOCIETIES FOR PRECISION ENGINEERING AND NANOTECHNOLOGY
(2022)
Article
Materials Science, Multidisciplinary
Runguang Li, Youkang Wang, Ning Xu, Zhiran Yan, Shilei Li, Minghe Zhang, Jonathan Almer, Yang Ren, Yan-Dong Wang
Summary: Laser shock-peening (LSP) can create complex gradients in microstructures and residual stresses, leading to improved mechanical properties of metallic engineering components. A non-destructive high-energy X-ray diffraction technique was used to investigate the effects of LSP on microstructure, surface topography, and residual stress in high purity titanium plates. LSP was found to generate large compressive in-plane residual stresses near the peened surface, gradually decreasing to zero below the surface. During in-situ tensile loading, stress partitioning and work-hardening rates were measured as a function of depth. The surface region exhibited the highest work-hardening rate and remained mechanically stable until sample failure.